Characteristics and manufacturing method of diamond blade

Diamond blade is a common laser cutting tool, which is widely used in the production of hard and brittle raw materials such as natural marble and pottery Diamond blade is mainly composed of two parts; Plates and blades The plate is an important fulcrum part of the bonding blade, and the blade plays a part of laser cutting in the whole process of application. The blade will continue to consume in application, while the plate is not easy. The blade can usually turn on the role of laser cutting because it contains diamond. Diamond, as a hard chemical at present, rubs in the blade. Laser cutting is the overall goal of production and manufacturing Diamond fine particles are wrapped in the blade by metal composites In the whole process of application, the green body of metal composite material is consumed together with diamond. Generally, the ideal situation is that the green body of metal composite material is consumed faster than refined steel, which can not only ensure the sharpness of the blade, but also ensure the long service life of the blade

With the rapid development of cars, international airlines and aerospace, the requirements for raw material characteristics and manufacturing professionalism are increasing. New materials such as carbon fiber polyurethane elastomer raw materials, fine particle lifting metal composite matrix fiber materials (PRMMC) and structural ceramics have been widely used. This kind of raw material has the characteristics of high tensile strength, good wear resistance and low coefficient of thermal expansion, which makes the service life of cutting tools very short when machining them. The design and development of new wear-resistant and stable superhard milling tools is a research topic of technological innovation in many colleges and universities, scientific research institutions and companies. Diamond integrates many excellent characteristics such as theoretical mechanics, optoelectronic devices, thermology, acoustic materials and optoelectronic devices. It has very high compressive strength, low friction, high thermal conductivity, low thermal expansion coefficient and analytical chemical ductility. It is an ideal raw material for the production and processing of cutting tools.