Global Electronic Potting & Encapsulating Market size was valued US$ XX Bn in 2019 and the total revenue is expected to grow at XX% through 2020 to 2027, reaching US$ XX Bn. The report has covered region wise market trends with competitive landscape. To know about the Research Methodology :- Request Free Sample Report Electronic Potting and Encapsulation is the process of the thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher atmospheres and mechanical shocks to retain them working accurately for a longer period. It also offers protection from corrosive agents and moisture. These processes also improve circuit reliability by reducing leakage from high voltage circuits.
Global Electronic Potting & Encapsulating Market Dynamics:
Consumers are more focused on the durability of electrical and electronic products are driving the electronic potting and encapsulating market growth over the forecasted period. Electronic potting and encapsulating provides several advantages like low costing of shells and reusable molds, better electric insulation, and efficient performance in extreme environments will impel market growth in the upcoming period. The electronic potting and encapsulation market drivers and restraints are covered in the report by region since each region has different market dynamics.
The COVID-19 outbreak has negatively impacted the global electronic potting and encapsulation market owing to the lockdowns imposed in several countries across the world. The pandemic has disrupted the momentum of the production and supply chain systems such as transportation and distribution mechanisms among suppliers, manufacturing units, and consumers. Globally, consumers have changed their buying pattern during the covid-19 pandemic period. Consumers have looked at products and brands on e-commerce platforms due to retailers closed their stores to help to reduce the spread of COVID-19. Supply chain point of view, the majority of raw materials have imported from emerging economies in Asia pacific. The foreign direct investment (FDI) has reduced approximately 15% due to an operation drop in the manufacturing sector in terms of an industrial unit shutdown. The Epoxies segment has led the electronic potting & encapsulating market in 2019 The MMR report covers the segments in the electronic potting & encapsulating market such as Potting Compound, application, End-use Industry, and region. Based on potting compound, the electronic potting & encapsulating market has segmented into epoxies, urethanes, silicones, and others. The Epoxies segment has led the electronic potting & encapsulating market in 2019 and is projected to grow at a CAGR of xx% over the forecast period. The epoxies potting have been broadly utilized form many years. It is generally high rigidity & tensile strength and exhibit low shrinkage on cure. Its offers an excellent level of mechanical properties, high temperature withstands capability, high electrical insulation, good chemical and moisture resistance, which has a positive impact on the segment growth in the market. But, the epoxies potting have a slow curing time, resulted in the epoxy potting process has a bottleneck in production, which impedes the segment growth in the market.
Asia Pacific held a prominent market share of xx% in 2019
Geographically, the electronic potting & encapsulating market has segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. Asia Pacific held a prominent market share of xx% in 2019 and is expected to reach US$ xx Mn by the end of 2027, with a CAGR of xx%. The presence of several well-established end-use industries and a large number of electronic potting & encapsulating manufacturers in the region, which are likely to boot the market growth in the coming years. Increasing investment in research and development activities for the introduction of an advanced type of potting materials are predicted to accelerate the market growth in the near future. China, India, and Japan are the leading contributors to the regional market growth. Among these, China accounted for the dominant market share of xx% in 2019 and is expected to grow at a CAGR of xx% over the forecast period. China is the manufacturing hub for electrical and electronics devices because of an easy availability of raw material, supportive government policies and low labor cost, which will responsible for market growth in the country. North America is expected grow at a CAGR of xx% during the forecast period thank to the rising demand for electronic potting and encapsulating in the consumer electronics sector in the regions. The objective of the report is to present a comprehensive analysis of the global electronic potting & encapsulating market including all the stakeholders of the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that includes market leaders, followers and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding global electronic potting & encapsulating market dynamics, structure by analyzing the market segments and project the global electronic potting & encapsulating market size. Clear representation of competitive analysis of key players by application, price, financial position, Product portfolio, growth strategies, and regional presence in the global electronic potting & encapsulating market make the report investor’s guide.
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Global Electronic Potting & Encapsulating Market, by Potting Compound
• Epoxies • Urethanes • Silicones • Others
Global Electronic Potting & Encapsulating Market, by Application
• Power Supplies • Motors • Connectors • Ignition Coils • Electronic Modules • Others
Global Electronic Potting & Encapsulating Market, by End-use Industry
• Consumer Electronics • Telecommunication • Automotive • Marine • Healthcare • Others
Global Electronic Potting & Encapsulating Market, by Region
• Asia Pacific • North America • Europe • Latin America • Middle East Africa
Global Electronic Potting & Encapsulating Market, Major Players
• Winmate Inc. • Henkel Corporation • Dymax Corporation • LANTAS Beck India Limited • ACC Silicones Ltd • Intertronics • DOPAG India Pvt. Ltd. • Parket Lord • MG Chemicals • EFI Polymers • Dow Corning • Hitachi Chemical • LORD Corporation • Huntsman Corporation • ITW Engineered Polymers • 3M • H.B. Fuller • John C. Dolph